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Pat Gelsinger, CEO of Intel Corporation and his delegation visited the Beijing Headquarter of H3C on July 12th. Accompanied by Brighten Li, Chairman of Tsinghua Unigroup and Tony Yu, Chairman of the Board of Unisplendour and CEO & President of H3C, the delegation visited the H3C Innovation Experience Center in Wangjing and engaged in in-depth discussions. Through the visit, the delegation gained a comprehensive understanding of H3C’s business landscape, market performance, R&D capabilities in hardware and software products, solution capabilities, as well as the collaborative achievements between both sides in such domains as computing, storage, networking, security, cloud intelligence, and terminal devices.
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As a leader in digital solutions, H3C has become one of Intel’s most important customers and partners in China, as well as a strategic global ecosystem partner. H3C’s strong product R&D and system engineering capabilities have played a key role in driving wide applications of Intel’s hardware and software technologies in the digitalization field.
Facing the booming demand for computing power in the new era of artificial intelligence, H3C joins hands with Intel to further strengthen the convergence and innovation in the sphere of computing power infrastructure. At the recently-concluded H3C NAVIGATE 2023 Summit, H3C officially launched the H3C UniServer G6 series servers based on 4th generation Intel® Xeon® scalable processors, which can realize a 53% increase in general computing power. H3C, Intel and the partners have jointly established the OTII-E modular edge server standard to meet the diverse customer demands. Based on this standard, they have developed a brand-new modular edge server that empowers efficient evolution in edge computing. Based on Intel’s next-generation Eagle Stream platform, H3C launched the industry’s first power-enhanced server – the H3C UniServer R4900PE G6, which adopts Intel’s CPU Power Corridor technology. The server can reduce total system power consumption by 12W, making it suitable for a wide range of energy-saving scenarios. Additionally, the H3C UniServer R5500 G6 series, a flagship AI server, will also be compatible with Intel’s 2nd generation Gaudi® accelerator – Habana® Gaudi®2, injecting surging momentum into the new era of AI.
On-site communication
In terms of intelligent terminals, H3C and Intel have jointly developed the world’s first 8K MagicHub which supports dual systems (Android and Windows systems) under the X86 architecture. This breakthrough in 8K full-link technology allows users to enjoy integrated, native 8K full-stack services for an immersive and authentic experience with features such as 8K UHD display, 8K teleconference.
H3C also partners with Intel in commercial PC, and launched a high-end ultra-thin business laptop, H3CBook Ultra 14T. Based on 13th generation Intel® Core™ processor, it supports Intel vPro® technology and has passed the stringent Intel Evo™ certification. By innovatively leveraging the Purple Shield secure SSD technology to safeguard data security, it provides customers with a comprehensive extraordinary experience and provides solid and reliable support for the digital transformation of all industries.
In addition, H3C and Intel have engaged in close collaboration in storage, HCI, private cloud, VCC, networking and other products such as intelligent gateways and cloud-based 5G small cells, as well as industrial internet and smart industry solutions. Adopting the principle of eco-friendly and low-carbon growth, both sides combine Intel’s high-performance and power efficient processor technology, liquid cooling technology, and intelligent energy-saving solutions to jointly create sustainable computing solutions that are green and energy-efficient.
Looking into the future, H3C will continue to uphold the strategy of “Dedication, For A Smarter Future”. Through fully relying on its own advantages, H3C will work together with Intel to continuously deepen collaboration and jointly cultivate the new era of AI.
Team photo
Christoph Schell, Rui Wang, Alan Wang, Hans Chuang, Danlin Chen, Louise Dunne from Intel and Steven Yoe, Wai Hoong Leung, Xi Yang, Yiping Liu, Ray Xu, Lang Bai, Huihua Huang, Michael Liu from H3C were also present at the event.